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頎邦科技股份有限公司 (以下簡稱頎邦科技) 成立於 1997 年 7 月，屬半導體下游之封裝測試業，企業總部位於新竹科學園區，於 2002 年正式在證券櫃檯買賣中心掛牌 (股票代碼：6147)。 公.
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Chipbond technology corporation (hereinafter referred to as chipbond) was founded in july 1997.
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